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ME-2240 is a potassium monopersulfate based microetch. ME-2240 provides superior surface topography and extended bath life when compared to generic sodium persulfate microetch.
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DC-3615 is a highly concentrated developer solution designed for use in photoresist and soldermask developing processes. Formulated using water softening agents, working solutions of DC-3615 can be made using tap water with up to 400 ppm’s ofdissolved solids without forming significant hardness scale. DC-3615 also contains cleaning compounds that help break up resist residues to prevent deposition and build up in process and control equipment. The IMAGEPRO developing systemcombines high quality with ease of use to provide a superior developing system.
CC-4405 is a highly concentrated sodium chlorate based oxidizer for use with cupric chloride etching processes. Our ready-to-use, liquid formulation provides the safest, most stableoxidizer to handle. Proprietary rate enhancers afford substantially increased etch rates over generic sodium chlorate, hydrogen peroxide and chlorine gas. When used in conjunctionwith the ETCHPRO CC-4000, CC-4405 provides the most consistent, efficient and economical etching process available.
AE-4860 is an ammoniacal etchant replenisher that has excellent stability and a high carrying capacity for copper. AE-4860 can be used with many types of resists and isformulated to minimize undercut of the circuitry.
NITROstrip NS-7117 strips tin and solder etch resists quickly and cleanly and leaves the underlying copper surface with a bright, uniform finish. NITROstrip NS-7117’s concentrated formulation allows the user to maintain fast strip rates with very high metal loading. Proprietary additives minimize copper attack and minimize sludge formation. NITROstrip NS-7117 can also be used to strip HAL solder when reworking is required. Use NITROstrip NS-7117 in batch or continuous replenishmentapplications.
OXYstrip TS-7240 is an ammonium bifluoride/hydrogen peroxide based tin/solder stripper. OXYstrip TS-7240 can be used in spray or immersion and for either full panel or tab stripping applications. OXYstrip TS-7240 is excellent for selective solder stripping applications where nickel/gold plating is present because it will not attack the nickel plating and cause gold slivers. OXYstrip TS-7240 strips tin/solder quickly and leaves the underlying copper surface clean, residue free and ready for subsequent processing. OXYstrip TS-7240 can be replenished with OXYstrip TS-7250 stabilized peroxide to extend bath life.