M803 is designed for use in SMOBC processes. It is used in combination with a pre-applied protective solder mask and provides full protection to the exposed holes in the board. M803 is applied at the plating line by either automated equipment or by hand, and serves as a failsafe line of demarcation at the connector tabs. The tape is used in conjunction with three process options: (1) plating gold over bare copper circuitry, (2) plating gold over bare copper circuitry after solder mask is applied and (3) plating gold after solder mask application and solder leveling. The tape is constructed of silicone adhesive and polyester backing. M803 is easily removed and leaves no adhesive residue, eliminating re-work. M803 is available in blue.